残余气体分析（RGA）

Residual Gas Analysis (RGA)

To prevent microelectronic component failures caused by chemical reactions (e.g., corrosion), it is essential to understand the internal gas composition of the components. MIL-STD-883, MIL-STD-750, Method 1018 typically serve as recognized standards for internal water vapor content. The Residual Gas Analysis (RGA) test method defines procedures for RGA equipment calibration and device testing, as well as maximum acceptable limits for internal water vapor content. With years of experience as a DLA (Defense Logistics Agency) accredited laboratory, EAG Laboratories is fully qualified for MIL-STD-883, 750, Method 1018 testing.

What is Residual Gas Analysis?

RGA is not limited to moisture content analysis. EAG's RGA testing system can detect all masses up to 140 AMU, enabling identification and quantification of common gases. Process atmosphere samples and unusual sealed environments can be analyzed to detect gas release or reabsorption. The system software can determine both moisture content within components and complete gas spectra.

In addition to standard RGA analysis, EAG possesses the technical expertise to identify sources of "problematic" internal gases and provide corrective actions when needed.

Electronic Component Reliability

The lifespan of electronic components follows predictable trends. Many fail prematurely during early operation ("infant mortality"). After surpassing this initial failure phase, they typically operate for extended periods with very low failure probabilities.

High-reliability electronic components often require long-term operation with minimal or no replacement opportunities. Orbital satellites serve as a prime example. Components meeting "space-use" requirements are also employed in applications where replacement is difficult and/or failures pose significant risks.

Addressing Reliability Challenges

Infant mortality issues can be mitigated through strict quality control during manufacturing:

• SEM inspection of metallization

• Glassivation analysis

• Thorough pre-cap inspections

• Electrical burn-in

• DPA procedures

Aging-related failures are typically associated with transient phenomena (e.g., ESD or EOS), mechanical shock, thermal cycling, or chemical reactions (e.g., corrosion).

Additional MIL-STD-883 Testing Services from EAG:

• Destructive Physical Analysis (DPA)

• Failure Analysis

• Fine/Gross Leak Testing

• Die Shear Testing

• Radiography

• SEM Inspection

• PIND Testing

• Bond Pull Testing

Ideal Applications of RGA
Packages: DIPs, Quad packages, TO-x cans, metal-lid devices, gas-filled containers, and numerous other geometries

Our Strengths

• Capability to identify all gases with molecular weights between 1-140 AMU through survey scans

• Quantitative analysis of up to 16 preselected components

• Compliance with military standards for high-reliability applications

Limitations

• Packages must be hermetically sealed

• Minimum cavity size: 0.01 cc

RGA Technical Specifications
Volume Range: 0.01 cc to 25 cc (precision radiography techniques determine package volume)
Analysis: Identification of all gases (1-140 AMU) via survey scans or quantitative analysis of up to 16 preselected components
MIL-STD-883/750 Testing: Measurement and reporting of nitrogen, oxygen, argon, carbon dioxide, moisture, hydrogen, helium, fluorocarbons, methane, and ammonia