电子显微镜成像

Advanced microscopy techniques such as SEM (Scanning Electron Microscopy) and TEM (Transmission Electron Microscopy) are fundamental tools for investigating the microstructure, morphology, particle size, coating layers, and defects in samples. These techniques often incorporate elemental mapping capabilities, including EELS (Electron Energy Loss Spectroscopy) and EDS (Energy Dispersive X-ray Spectroscopy), which provide valuable information about elemental composition and spatial distribution.

EAG offers a wide range of microscopy tools and services with an extensive installed base to meet your application needs—from process development to failure analysis. Beyond delivering high-resolution imaging, our analytical expertise makes us a unique partner in supporting your research, development, and failure investigation efforts.

Microscopy techniques can be used to characterize various types of defects, including:

• Metal migration: FIB cross-sectioning and STEM/EDS analysis

• Voids: FIB cross-sectioning and SEM examination

• Particles: Surface imaging or FIB cross-sectioning to study size, chemistry, and location within layer stacks

• Cracks and delamination: Small-area FIB cross-sections or large-area argon ion milling to determine the location of delamination interfaces, followed by TEM microanalysis (if needed) to assess interfacial chemistry

• Thickness and uniformity: FIB cross-sectioning and SEM evaluation

Materials analyzed using advanced microscopy techniques include:

• Nanoparticles

• Alloys and metals

• Thin films

• Coatings on glass, silicon, or carbon substrates

• Ceramics

• Composite materials

• IC devices

• Anodized aluminum